Flip chip packaging process and device

Patent name: Flip chip packaging process and device Patent number 4 Publication number: 1499589
China Day: 2002 11 04 Public Day: 2004 05 26
Invited by: Taiwan Silicon Integrated Technology Co., Ltd. This flip-chip packaging process and its apparatus are applicable to the method of filling the primer, including the following steps: providing a wafer with an active surface, the active surface having a plurality of spaced metals a substrate provided with a wafer bonding area on the surface thereof, the wafer bonding area having a plurality of spaced-apertures, a pre-soldered solder pad, and a screen printing method forming a bond between the bonding pads in the wafer bonding area; Filling the glue material; bonding the metal bumps to the pads to adhere the wafers to the substrate. In a flip-chip packaging device in a flip-chip packaging process, a filling material is formed on a substrate through a printing block by using a screen printing method. The printing screen plate includes printing blocks and other areas, and the printing area includes multiple An opening area and a plurality of shielding parts, and a plurality of connection lines are used to connect the shielding part and the other parts of the printing screen plate and the shielding part. By using this method, the yield of the underfill in the flip chip package can be increased, the excellent rate of the flip chip package process can be improved, and the reliability and the service life of the flip chip package can be improved.

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